MIL-STD-1798 Mechanical Equipment And Subsystems Integrity ProgramThe purpose of this standard is to describe the general process to achieve and maintain the physical and functional integrity of the mechanical elements of aircraft systems. The goal of this integrity program is to achieve the desired level of safety and aircraft availability at the most economic cost across the life cycle of the weapon system. This standard allows the process to be tailored in a competitive environment to meet specific equipment, subsystem, and/or system requirements. The Mechanical Equipment and Subsystems Integrity Program MECSIP is implemented in the planning process and continued until retirement of the system.

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MIL-STD-1798C

advance of the decision. NOTE: SLAP is only required to be executed on safety-critical parts. The Program Office may wish to include other components based on cost, obsolescence, reliability drivers, etc.

5.5.5.1.3 Service Life Assessment of EWIS

5.5.5.1.3.1 EWIS Task Three. (See EWIS MIL-HDBK-525 for more details.)

a. Conduct an on aircraft physical and electrical inspection and document overall condition of the aircraft EWIS. (Reference MIL-HDBK-525's appendix D and use AC 25-27A as guidance). Results of this EWIS Task may be used to identify and target critical problem areas for further evaluation.

b. Use available wiring design and installation documents AS50881 or applicable platform specific contractual design/installation documents.

c. Conduct a physical inspection and document overall condition of aircraft electrical system using guidelines established in MIL-HDBK-525 and/or NAVAIR Standard Work Package (SWP) 4.4.5.3, AIRCRAFT WIRING ASSESSMENT REPORT.

d. Specifically examine wiring for exposed conductors, cracked or deteriorated insulation, loss of insulation mechanical properties, excessive splices or presence

of contamination/corrosion.

e. Examine circuit breakers, distribution panels, and other conductive path components for corrosion, thermal damage, and electrical degradation.

f. Large or complex areas should be broken down into manageable size. Emphasize

SWAMP and high-maintenance areas.

5.5.5.1.3.2 EWIS Task Four. (See EWIS MIL-HDBK-525 for more details.)

a. Conduct a destructive materials/aging analysis of wiring and electrical components removed from the aircraft based on information gathered in earlier EWIS Tasks.

b. Conduct a lab visual and optical inspection to document condition of components and follow with a detailed materials and aging analysis of selected EWIS components.

c. Wiring insulation and conductor integrity d. Protective harness materials

e. Shield and ground terminations

f. Connector contact integrity and shield effectiveness g. Circuit breaker contact integrity and the trip curve

h. Relay contact integrity and actuation performance

i. Switch contact integrity and actuation performance j. Electrical distribution panels

k. Terminal boards, ground studs, and connector back shells

l. Compare condition of components with new (unused) components

m. Apply aging assessment techniques and aging/degradation models to determine remaining life of EWIS components.