MIL-STD-792F(SH)
19 May 2006
CONTENTS
Page
Paragraph |
1. |
SCOPE ...............................................................................…………. 1 |
1.1 |
Purpose............................................................................................1 |
|
1.2 |
Applicability......................................................................................1 |
|
2. |
REFERENCED DOCUMENTS ...........................................................1 |
|
2.1 |
General ............................................................................................1 |
|
2.2 |
Government Documents ..................................................................1 |
|
2.2.1 |
Specifications, standards and handbooks ......................................1 |
|
2.2.2 |
Other Government documents ........................................................1 |
|
2.3 |
Non-Government publications .........................................................2 |
|
2.4 |
Order of precedence........................................................................2 |
|
3. |
DEFINITIONS .....................................................................................2 |
|
3.1 |
Identification marking.......................................................................2 |
|
3.2 |
Permanent marking..........................................................................2 |
|
3.3 |
Temporary marking .........................................................................2 |
|
3.4 |
Low stress die stamps .....................................................................2 |
|
3.5 |
Authorized representative of Naval Sea Systems Command (NAVSEA) .....................................................................................3 |
|
3.6 |
Layout marking ................................................................................3 |
|
4. |
GENERAL REQUIREMENTS.............................................................3 |
|
4.1 |
Permanent marking methods...........................................................3 |
|
4.2 |
Temporary marking methods ...........................................................3 |
|
5. |
DETAILED REQUIREMENTS ............................................................4 |
|
5.1 |
Type I, vibrating marking tools.........................................................4 |
|
5.2 |
Type II, electrochemical etching ......................................................4 |
|
5.3 |
Type III, raised markings..................................................................4 |
|
5.4 |
Type IV, nameplates .......................................................................4 |
|
5.5 |
Type V, die stamping ......................................................................4 |
|
5.6 |
Type VI, special marking..................................................................4 |
|
5.7 |
Type VII, engrave marking...............................................................5 |
|
5.8 |
Type VIII, laser engraving ...............................................................5 |
|
5.8.1 |
Type IX, dot matrix marking…………………....................................5 |
|
5.9 |
Limitations on identification marking ...............................................6 |
|
5.10 |
Limitations on permanent identification marking..............................6 |
|
5.11 |
Limitations on temporary identification or layout marking................7 |
|
5.11.2.1.1 |
Surfaces without crevices or inaccessible areas .............................8 |
|
5.11.2.1.2 |
Surfaces with crevices and inaccessible areas................................8 |
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